Line board wave soldering quality is every high quality processing factory need to pay attention to the problem, today, let the experienced GT technical staff to explain to you what factors affect the quality of PCBA wave soldering?
What are the factors that affect the quality of PCBA wave soldering?
PCBA circuit board is made by the designer in accordance with the predetermined technical requirements, through the wiring and installation design, the arrangement and combination of multiple electronic components on the PCB. In the arrangement and combination, the designer must comply with the constraints of the wave soldering process and cannot act on their own. For hundreds of arranged and combined electronic components, different metals can be connected with solder. The need to weld a large number of solder joints simultaneously in a few seconds requires body metals that can be easily and quickly welded. Therefore, materials with good solderability must be selected in the design.
Heating and melting the solder is a fundamental part of the welding operation. Solder flux is usually used on the welding surface to promote wetting of the solder to the weld metal. It has been proven that the strength and reliability of a solder joint depends entirely on the good wetting of the solder to the solder metal. Therefore, the selection of the best performing solder and flux is a non-negligible factor that directly affects the wetting effect.
Temperature, time and pressure conditions are critical in the metallurgical process of solder joints. Therefore, good wave soldering equipment and reasonable selection and control of process parameters are the basis for ensuring temperature, time, pressure and other conditions. Only with full consideration of the above requirements, PCBA wave soldering process can achieve good results.