Custom Automobile Data Recorder SMT PCB Assembly

1. High frequency PCBs Radars incorporated in automotive require PCBs that transmit microwave high-frequency signals. In these cases, substrate materials with low dielectric loss are suggested. The substrate also consists of polytetrafluoroethylene (PTFE). This is different from the common FR-4 used. They also have different and distinct manufacturability. 2. Heavy copper PCBs More advanced devices require more heat dissipation and larger current. In order to achieve this, the thickness of copper in PCB is increased. Heavy copper multi-layer PCBs are generally more difficult to fabricate than heavy copper double-layer PCBs. The inner circuit of heavy copper multi-layer PCB is heavy copper. The graphics transferring require a heavy film that shows resistance to corrosion. Similarly, the etching time is longer and the overall aim should be to ensure excellent quality of heavy copper circuits. In the case of the generation of cavities in multi-layer PCB, then thin prepreg (containing a high amount of resin) is used. 3. Component embedment Embedment technology is used in automotive electronics because it helps to increase assembly density and reduce the size of the product. There are many embedded PCB manufacturing options based on component embedment methods. These include:

• First, the groove is milled then the SMD (Surface Mount Device) is assembled through wave soldering or conductive paste.
• Thin-film Surface Mount Devices (SMDs) are assembled on inner circuits by wave soldering.
• Thick-film components are printed on a ceramic base.
• SMDs are first assembled through wave-soldering then resin is used for packaging.

4. HDI (High-Density Interconnect) technology Just as smartphones and tablets call for HDI PCBs, so do vehicles. They allow for communication and have functions of entertainment. Resultantly, microtia drilling, electroplating, and interconnection technologies are applied in automotive PCBs.