Printed circuit board

PCB circuit board copper foil basic knowledge

Copper foil (copper foil): an anionic electrolytic material, deposited on the substrate layer of the circuit board a thin, continuous layer of metal foil, which serves as the conductive body of the PCB. It is easily bonded to the insulating layer, accepting the printed protective layer and forming the circuit pattern after corrosion. copper mirror test (copper mirror test): a flux corrosion test, using a vacuum precipitation film on the glass plate.

Copper foil is made of copper plus a certain percentage of other metals. 90 foil and 88 foil are generally available, i.e. 90% and 88% copper content, with a size of 16*16cm. copper foil is the most widely used decorative material. Such as: hotel**, temple statue, gold signboard, tile mosaic, handicraft, etc.

II. Product characteristics

Copper foil has low surface oxygen characteristics, can be attached to a variety of different substrates, such as metal, insulation materials, etc., has a wide range of temperature use. Mainly used in electromagnetic shielding and anti-static, the conductive copper foil is placed on the substrate surface, combined with metal substrates, has excellent conductivity and provides electromagnetic shielding effect. It can be divided into: self-adhesive copper foil, double-conducting copper foil, single-conducting copper foil, etc.

Electronic grade copper foil (purity 99.7% or more, thickness 5um-105um) is one of the basic materials for the electronic industry The rapid development of the electronic information industry has led to the increasing use of electronic grade copper foil, and the products are widely used in industrial calculators, communication equipment, QA equipment, lithium-ion batteries, civilian TV sets, VCRs, CD players, copiers, telephones, heating and cooling air conditioners, automotive electronic parts, game consoles, etc. The demand for electronic grade copper foil, especially high performance electronic grade copper foil, is increasing in domestic and international markets. Relevant professional institutions predict that by 2015, China’s domestic demand for electronic-grade copper foil will reach 300,000 tons, China will become the world’s largest printed circuit boards and copper foil base **, electronic-grade copper foil, especially high-performance foil market.

Third, the global supply of copper foil status

Industrial copper foil can be commonly divided into calendered copper foil (RA copper foil) and dotted copper foil (ED copper foil) two categories, of which calendered copper foil has better ductility and other characteristics, is the early soft board process used in the copper foil, while electrolytic copper foil is with ** the advantage of lower cost than calendered copper foil. Since calendered copper foil is an important raw material for flexible boards, improvements in the characteristics and price changes of calendered copper foil have a certain impact on the flexible board industry.

Since there are few manufacturers of calendered copper foil and the technology is in the hands of some manufacturers, customers have less control over the price and supply, so replacing calendered copper foil with electrolytic copper foil is a viable solution without affecting product performance. However, if the physical characteristics of the copper foil structure will affect etching in the next few years, the importance of calendered copper foil will rise again in the case of fine-line or thin products, and in the case of high-frequency products due to telecommunications considerations.

There are two major barriers to the production of calendered copper foil: resource barriers and technical barriers. The resource barrier refers to the fact that the production of calendered copper foil needs to be supported by copper raw materials, and the possession of resources is very important. On the other hand, there are technical barriers that discourage new entrants, not only in terms of calendering technology, but also in terms of surface treatment or oxidation technology. Most of the major global manufacturers have many patents and know how of key technologies, increasing the barriers to entry. If new entrants adopt post-processing production, they are subject to the cost pincers of the large manufacturers, and it is not easy for them to successfully join the market.

Development of copper foil

Copper foil English for electrodepositedcopperfoil, is a copper clad board (CCL) and printed circuit board (PCB) ** important materials. In the rapid development of today’s electronic information industry, electrolytic copper foil is known as: electronic products signal and power transmission, communication “nerve network”. 2002, China’s printed circuit board production value has crossed into the world’s 3rd, as the PCB substrate material – – copper laminate has also become the world’s leading PCB material. -Copper clad board has also become the world’s 3rd largest producer. As a result, China’s electrolytic copper foil industry has grown by leaps and bounds in recent years. In order to understand the past, present and future of the development of the electrolytic copper foil industry in the world and China, experts from the China Epoxy Resin Industry Association have reviewed its development.

From the perspective of the production department and market development of the electrolytic copper foil industry, its development history can be divided into three major development periods: the period when the United States created the first copper foil enterprises in the world and started the electrolytic copper foil industry; the period when Japanese copper foil enterprises fully monopolized the world market; and the period when the world multipolarly competed for the market.


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