| Project |
Feature |
Capability |
| Material |
|
FR-4 \CEM-1\ CEM-3 |
| Product Size |
Max Finished Product Size（L*W) |
1400mm×622mm |
| Layer Count |
|
min/max:1-18 Layers |
| Board Thickness |
Single/Double -Sided (min/max) |
0.15mm/7.0mm |
| 4 Layers(min/max) |
0.40mm/3.50mm |
| 6 Layers(min/max) |
0.60mm/3.50mm |
| 8 Layers(min/max) |
0.80mm/3.50mm |
| 10 Layers(min/max) |
1.20mm/3.50mm |
| 12 Layers(min/max) |
1.50mm/3.50mm |
| Board thickness Tolerance |
±10% |
| hole |
Min hole Size（PTH/NPTH）
|
0.10mm/0.15mm |
| Min finished slot（PTH/NPTH） |
0.45×0.75mm/0.50×0.80mm |
| Hole Tolerance PTH（min） |
±0.076mm |
| Hole Tolerance NPTH（min） |
±0.05mm |
| Hole position Tolerance |
±0.075mm |
| Min line width and line spacing |
Base Copper 1/4OZ |
0.075mm/0.075mm |
| Base Copper 1/3OZ |
0.075mm/0.09mm |
| Base Copper 0.50Z |
0.10mm/0.10mm |
| Base Copper 1 0Z |
0.15mm/0.15mm |
| Base Copper 2 0Z |
0.20mm/0.20mm |
| Base Copper 30Z |
0.254mm/0.30mm |
| Base Copper 4 0Z |
0.305mm/0.40mm |
| Base Copper 5OZ |
0.40mm/0.45mm |
| Line width, line spacing etch tolerance |
±20% |
| Dry Film Tent Hole Capability |
6.00mm(MAX) |
| Distance |
Min Annular Ring:Inner Layer |
0.18mm(Via: 0.13mm)min |
| Min Annular Ring:Outer Layer |
0.18mm(Via: 0.13mm)min |
| Cu To Outline On Inner Layer |
0.20mm(min) |
| Cu to Outline On Outer Layer |
milling:0.20mm(min) |
| punching:0.30mm(min) |
| V-cut:0.35mm(min) |
| NPTH Hole To Cu |
0.20mm(min) |
| Copper Thickness |
Finished Copper Thickness |
0.5 0Z - 6 0Z |
| Cu In Hole Wall |
18um (min) |
| Surface Treatment |
Immersion Nickel Gold |
Nickel Thickness:100-300µ" |
| Gold Thickness:1-5µ" |
| Electroplated Nickel Gold |
Nickel Thickness:100-300µ" |
| Gold Thickness:1-60µ" |
| Immersion Tin Thickness |
0.8-1.2um |
| Immersion Silver Thickness |
0.12-0.45um |
| HAL thickness |
1µm(min) |
| Solder mask |
Min S/M Bridge |
green S/M: 0.076mm |
| not green S/M: 0.090mm |
| S/M Opening Bigger Than Pad |
0.025mm |
| Min S/M Thickness |
Line Angle ≥5µm， |
| Line Surface ≥10um |
| Min Distance From Line To S/M Opening |
0.05mm |
| Silkscreen |
Min Character Height |
0.71mm |
| Min character line Width |
0.12mm |
| Profile |
Outline Tolerance |
Milling:±0.127mm |
| Beering:±0.10mm |
| V-cut |
Angle：30/45/60 |
| Position Accuracy:±0.10mm |
| Alignment Accuracy:0.10mm |
| Panel L× W:65.00mm×65.00mm |
| Minimum Punch Hole |
Board Thickness 80% |
| Minimum Punch Slot |
Board Thickness 80% |
| Minimum Milling Slot |
1.00mm×3.00mm |
