| Material |
Nominal Material |
PI |
|
| Special Material |
Custmer Requred |
|
| Product Size |
Max Product Size（L*W) |
600mm×250mm |
1200mm×500mm |
| Min Product Size（L*W) |
10x15mm |
2.0x0.5mm |
| Layer |
Min/Max |
0-6 Layers |
6-12 |
| Board Thickness |
Min |
0.05mm |
|
| Max |
0.75mm |
|
| Tolerance |
±0.05mm |
±0.03mm |
| Hole |
Min PTH/NPTH |
0.10mm |
0.05mm |
| Max PTH/NPTH |
6.4mm |
|
| Min PTH/NPTH |
0.50×1.10mm |
|
|
|
|
| Min Punch Hole |
0.7-0.80mm |
|
| Hole Tolerance PTH（min） |
±0.076mm |
±0.05mm |
| Hole Tolerance NPTH（min） |
±0.05mm |
±0.05mm |
| Hole Position |
±0.05mm |
±0.05mm |
| Min Trace Width And Space |
Finsih Cu Thickness 1/3OZ |
0.075mm/0.075mm |
|
| Finsih Cu Thickness 0.50Z |
0.075mm/0.09mm |
|
| Finsih Cu Thickness 10Z |
0.10mm/0.15mm |
0.10mm/0.10mm |
| Finsih Cu Thickness 2OZ |
0.20mm/0.20mm |
|
| Finsih Cu Thickness 3OZ |
0.20mm/0.30mm |
|
| Trace Width And Space Etch Tolerance |
±20% |
±0.02mm |
| Graphics Alignment Accuracy |
±0.05mm |
|
| Distance |
Min Annular Ring Inner Layer |
0.18mm(Via: 0.10mm)min |
|
| Min Annular Ring Outer Layer |
0.18mm(Via: 0.10mm)min |
|
| NPTH to Cu |
0.20mm(min) |
|
| Cu thickness |
Finish Copper Thickness |
1/3-3OZ |
|
| Cu In Hole Wall |
10-12µm(min) |
20um min |
| surface treatment |
Immersion Ni |
100-300µ" |
100-300µ" |
| Immersion Au |
1-5µ" |
1-5µ" |
| Immersion Ni |
100-300µ" |
100-300µ" |
| Immersion Pa/Au |
2µ"/1-5µ" |
|
| Electroplated Nickel Gold Ni |
100-300µ" |
100-300µ" |
| Electroplated Nickel Gold Au |
1-60µ" |
|
| Immersion Tin |
0.8-1.2um |
|
| Immersion Silver |
0.12-0.5um |
|
|
OSP |
0.12-0.3um |
|
| Solder Mask/Coverlay |
Min BridgeS/M |
0.09mm |
|
| Min Bridge Coverlay |
0.20mm |
0.15mm |
| Opening Bigger Than Pad |
S/M≥0.03mm； |
|
|
Coverlay≥0.1mm |
|
| S/M /Coverlay Thickness |
On Conductor Edge≥5µm，On Conductor Surface≥10um；Coverlay Thickness(Including AD)：25um/37.5um/50um/60um |
|
| Silkscreen |
Min Character Height |
0.71mm |
|
| Min Character Line Width |
0.127mm |
|
| Alignment Accuracy |
±0.30mm |
|
| Profile |
Tolerance Lasering |
±0.10mm |
±0.05mm |
| Tolerance Punch |
±0.10mm |
±0.05mm |
| Tolerance Knife Punch |
±0.30mm |
|
| Stiffener (FR4)Alignment Accuracy |
±0.20mm |
|
| Stiffener (PI)Alignment Accuracy |
±0mm |
|
| Type |
PI(0.1-0.275), steel sheet ,304, plate Ni steel sheet(0.1-0.5)，FR4(0.1-1.6) |
| Minimum Punch Hole |
Board Thickness 80% |
1.0mm |
| Minimum Punch Slot |
Board Thickness 80% |
1.0mm×1.0mm |
| Minimum Milling Slot |
1.00mm×3.00mm |
1.0mm×3.0mm |
